First Report of Activities at UPENN
"Understanding a Cryogenic system, design of its individual
components, and design and testing bolometers"
Daniel Ferrusca -- INAOE
Miguel Velazquez – INAOE
Dr. David Hughes
Dr. Mark Devlin
May 21st – July 21st
Main activities at UPENN Lab:
General understanding of a cryogenic system.
General Understanding of a Preamplifier stage for a cryogenic system
Figure 1, The components of the Preamplifier
Figure 2 , Rear top view of the Preamplifier box
Figure 3, Front view of Preamplifier box
Figure 4, Completed box of preamplifier
Construction and assembly of JFET (Cu encapsulation).
Figure 5, JFET connections
Figure 6, Final JFET Cu can
Design and construction of Cu-Al test table for cryostat base plate.
Figure 7, Test Cu-Al table for Cryostat
Design and construction of special purpose copper block to interface outside connectors to inside sensor connectors.
Figure 8, Cu block interface
Figure 8, Cu block interface (another view)
Construction of outside connector of cryostat.
Soldering of manganin wires to outside connector of cryostat. (this wires will be connected to special purpose copper block interface for outside connectors)
Figure 9, The cryostat, with our test table with JFET Cu can behind the fridge, and our Cu block interface at the front
Figure 10, A view of the Cryostat, we are working with , now.
Figure 11, A close view of the base plate of the Cryostat
Figure 12, A
view of the Cryostat that came from
Figure 13, A
top view of the Cryostat that came from
Figure 14, A bolometer of the UPenn Lab
Figure 14, Another bolometer of the UPenn Lab
Some of the equipment we have bought:
Figure 15, Temperature controller, to be used at temperatures as low as 100 mK
Figure 15, Temperature monitor
Figure 16, BNC connectors to connect IN/OUT signals to DAQ computer card (not shown)
Figure 17, Ruthenium Oxide Temperature Sensor to be used from 0.05 K to 40 K
Figure 18, A close view of the Ruthenium Oxide Temperature Sensor
Figure 18, Silicon Diode Temperature Sensor to be used from 1.4 K to 475 K
Figure 19, Close view of the Silicon Diode Temperature Sensor
Other activities include:
Calculations of Heat Capacity for different materials.
Connections of CRYCON Temperature Controller to PC computer.
Connections of LAKESHORE Temperature Monitor to PC computer.
Connections of DAQ board to PC.
Connections of GPIB board to PC
Intallation of LABVIEW software in Windows 2000.
Figure 20, Daniel Ferrusca showing the parts made at Upenn Lab
Figure 21, Miguel Velazquez with the cryostat